Joseph T. DiBene

Power Integrity

• Gebundenes Buch

Produktbeschreibung

Aimed at engineers interested in learning the fundamentals and advanced topics of power integrity, this book places a special focus on computer systems and the silicon level power delivery that makes it unique. The author's unique and extensive background in the power integrity industry makes him an ideal and invaluable source of information. Topics covered include: fundamentals in power distribution, power integrity analysis basics, system level power integrity considerations, power conversion in computer systems, and more.

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An all-encompassing text that focuses on the fundamentals of power integrity

Power integrity is the study of power distribution from the source to the load and the system level issues that can occur across it. For computer systems, these issues can range from inside the silicon to across the board and may egress into other parts of the platform, including thermal, EMI, and mechanical.

With a focus on computer systems and silicon level power delivery, this book sheds light on the fundamentals of power integrity, utilizing the author's extensive background in the power integrity industry and unique experience in silicon power architecture, design, and development. Aimed at engineers interested in learning the essential and advanced topics of the field, this book offers important chapter coverage of fundamentals in power distribution, power integrity analysis basics, system-level power integrity considerations, power conversion in computer systems, chip-level power, and more.

Fundamentals of Power Integrity for Computer Platforms and Systems:
Introduces readers to both the field of power integrity and to platform power conversion
Provides a unique focus on computer systems and silicon level power delivery unavailable elsewhere
Offers detailed analysis of common problems in the industry
Reviews electromagnetic field and circuit representation
Includes a detailed bibliography of references at the end of each chapter
Works out multiple example problems within each chapter

Including additional appendixes of tables and formulas, Fundamentals of Power Integrity for Computer Platforms and Systems is an ideal introductory text for engineers of power integrity as well as those in the chip design industry, specifically physical design and packaging.

Produktdetails

• Verlag: Wiley & Sons
• 1. Auflage
• Seitenzahl: 280
• Erscheinungstermin: 3. März 2014
• Englisch
• Abmessung: 236mm x 157mm x 20mm
• Gewicht: 499g
• ISBN-13: 9781118091432
• ISBN-10: 1118091434
• Artikelnr.: 36726607

Autorenporträt

J. TED DIBENE II, PhD, is a Senior Power Architect at Intel Corporation. His main focus is in the area of power management and power delivery for advanced microprocessors, SoC's, and other silicon devices. Prior to joining Intel, Dr. DiBene held the position of CTO at INCEP Technologies Inc., which he cofounded in 1999.

Inhaltsangabe

Foreword by James L. Knighten xi Preface xiii Acknowledgments xv Acronyms xvii 1 Introduction to Power Integrity 1 1.1 Definition for Power Integrity
2 1.2 Historical Perspective on Power Integrity Drivers
3 1.3 First Principles Analysis
6 1.3.1 Steps to Solve Power Distribution Problems
7 1.3.2 Limitations in the Analytical and Numerical Process
9 1.4 Scope of the Text
13 References
15 2 Introduction to Platform Power Conversion 16 2.1 Power Distribution System
17 2.1.1 Centralized and Distributed Distribution Systems
17 2.1.2 Static Losses in the System Power Path
18 2.2 Platform DC-to-DC Power Conversion
21 2.2.1 Popular Converter Types
22 2.2.2 The Linear Regulator
22 2.2.3 The Buck Regulator
26 2.2.4 LC Filter Operation
32 2.2.5 Power Switch Basics
34 2.2.6 The Controller
39 2.2.7 Inductors
41 2.2.8 Coupled Inductors
44 2.2.9 Multi-phase Buck Converters
45 2.2.10 The Tapped-Inductor Buck Converter
47 2.3 Layout and Noise Considerations
48 2.4 Summary
50 References
51 Problems
51 3 Review of Electromagnetic Field and Circuit Representations 53 3.1 Vectors and Scalars
54 3.1.1 Coordinate Systems
55 3.1.2 Vector Operations and Vector Calculus
58 3.2 Static Fields
60 3.2.1 Electrostatics
60 3.2.2 Magneto-Statics
68 3.2.3 Conduction and Resistance
72 3.3 Maxwell's Equations
74 3.3.1 The Wave Equation
75 3.3.2 Lossless and Lossy Media
77 3.4 Useful and Simple Circuit Extractions
79 3.4.1 "Power Plane" Inductance
79 3.4.2 Inductance of Two Circular Wires in Space
80 3.4.3 Resistance between Two Vias in a Power Plane
83 3.4.4 Notes on Applicability of Formulas
84 3.5 Summary
84 References
85 Problems
86 4 Power Distribution Network 88 4.1 The Power Distribution Network
89 4.2 PDN Elements
94 4.2.1 PCB Network
95 4.2.2 Socket Distribution
102 4.2.3 Contact Resistance
104 4.2.4 Package Distribution
108 4.2.5 Decoupling Basics and Capacitors
112 4.3 Impedance Distribution Analysis
117 4.3.1 Analysis of a PDN Structure through First Principals
117 4.3.2 Analysis of a Full PDN Structure
122 4.4 Summary
127 References
128 Problems
129 5 Power Integrity Time-Domain and Boundary Analysis 131 5.1 Source and Load Modeling
131 5.1.1 Source Representations
132 5.1.2 Load Representations
145 5.2 Time-Dependent Systems
152 5.2.1 Voltage Bus Droop Boundary Conditions
153 5.2.2 Voltage Bus Droop Boundary Analysis
154 5.3 Impedance/Load Boundary Analysis
158 5.4 Summary
165 References
166 Problems
167 6 System Considerations for Power Integrity 168 6.1 Power Loadline Fundamentals
169 6.1.1 Loadline
170 6.1.2 Tolerance Band and Voltage Guardband
172 6.2 Noise Generation Considerations in Power Integrity
181 6.2.1 Self-generated Power Bus Noise
181 6.2.2 Coupled Power Bus Noise
186 6.2.3 Simultaneous Switching Noise
194 6.3 Power Noise Reduction Techniques
196 6.4 EMI Considerations for Power Integrity
199 6.5 Power Integrity PDN in System Measurements
205 6.6 Summary
207 References
208 Problems
210 7 Silicon Power Distribution and Analysis 211 7.1 Silicon and Package Power Integrity
212 7.1.1 Silicon Interconnection for Power Distribution
215 7.1.2 Resistance and Current Density Considerations
219 7.1.3 PDN Considerations for On-package VR Systems
226 7.2 Silicon and Package Power Delivery
232 7.2.1 On-package Power Delivery
233 7.2.2 Package and On-Silicon Power Delivery Trade-offs
234 7.3 On-die Decoupling
237 7.4 Advanced Topics in Power on Silicon
242 7.5 Summary
244 References
245 Problems
246 Appendix A Table of Inductances for Commonly Used Geometries 247 Appendix B Spherical Coordinate System 250 Appendix C Vector Identities and Formulae 252 Index 255