![Advances in Electronic Circuit Packaging Advances in Electronic Circuit Packaging](https://bilder.buecher.de/produkte/41/41330/41330363n.jpg)
Broschiertes Buch
Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19¿21, 1964
Softcover reprint of the original 1st ed. 1965
1. Januar 1965
Springer / Springer US / Springer, Berlin
978-1-4899-7295-8
![Advances in Electronic Circuit Packaging Advances in Electronic Circuit Packaging](https://bilder.buecher.de/produkte/40/40818/40818746n.jpg)
Broschiertes Buch
Volume 3
Softcover reprint of the original 1st ed. 1963
1. Januar 1963
Springer / Springer US / Springer, Berlin
978-1-4899-7296-5
Ähnliche Artikel
![Advances in Electronic Circuit Packaging Advances in Electronic Circuit Packaging](https://bilder.buecher.de/produkte/40/40820/40820297n.jpg)
Broschiertes Buch
Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
Softcover reprint of the original 1st ed. 1962
1. Januar 1962
Springer / Springer US / Springer, Berlin
978-1-4899-7297-2
![High-Speed CMOS Circuits for Optical Receivers High-Speed CMOS Circuits for Optical Receivers](https://bilder.buecher.de/produkte/39/39612/39612720m.jpg)
Broschiertes Buch
Softcover reprint of the original 1st ed. 2001
16. März 2013
Springer US / Springer, Berlin
![Transactions on Engineering Technologies Transactions on Engineering Technologies](https://bilder.buecher.de/produkte/45/45752/45752872m.jpg)
Broschiertes Buch
International MultiConference of Engineers and Computer Scientists 2013
Softcover reprint of the original 1st ed. 2014
17. September 2016
Springer / Springer Netherlands
978-94-024-0220-9
![Radiators in Hydronic Heating Installations Radiators in Hydronic Heating Installations](https://bilder.buecher.de/produkte/47/47569/47569452m.jpg)
Gebundenes Buch
Structure, Selection and Thermal Characteristics
1st ed. 2017
27. März 2017
Springer / Springer International Publishing / Springer, Berlin
978-3-319-55241-5
![Analysis and Synthesis of MOS Translinear Circuits Analysis and Synthesis of MOS Translinear Circuits](https://bilder.buecher.de/produkte/39/39160/39160686m.jpg)
Broschiertes Buch
Softcover reprint of the original 1st ed. 1993
30. September 2012
Springer / Springer US / Springer, Berlin
978-1-4613-6411-5
![Models for Large Integrated Circuits Models for Large Integrated Circuits](https://bilder.buecher.de/produkte/39/39561/39561827n.jpg)
Broschiertes Buch
Softcover reprint of the original 1st ed. 1990
27. Dezember 2011
Springer / Springer US / Springer, Berlin
978-1-4612-8833-6
![High-Frequency Characterization of Electronic Packaging High-Frequency Characterization of Electronic Packaging](https://bilder.buecher.de/produkte/41/41323/41323684n.jpg)
Broschiertes Buch
Softcover reprint of the original 1st ed. 1998
23. Februar 2014
Springer / Springer US / Springer, Berlin
978-1-4613-7573-9
![Wideband Amplifiers Wideband Amplifiers](https://bilder.buecher.de/produkte/41/41533/41533765m.jpg)
Broschiertes Buch
2006
18. September 2014
Springer / Springer US / Springer, Berlin
978-1-4899-9597-1
![Switch-Level Timing Simulation of MOS VLSI Circuits Switch-Level Timing Simulation of MOS VLSI Circuits](https://bilder.buecher.de/produkte/39/39678/39678954n.jpg)
Broschiertes Buch
1989
5. Oktober 2011
Springer / Springer US / Springer, Berlin
978-1-4612-8963-0
Ähnlichkeitssuche: Fact®Finder von OMIKRON