RF Measurements of Die and Packages - Wartenberg, Scott A.
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The explosion in the wireless industry, coupled with the higher frequencies in today's digital integrated circuits (IC) has made vital the need for accurate IC testing. This is the first book dedicated to the issues surrounding RFIC testing. This ground breaking work enables professionals to perform high-accuracy RF measurements of die and packages in the RF test lab. This timely volume defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration.

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Produktbeschreibung
The explosion in the wireless industry, coupled with the higher frequencies in today's digital integrated circuits (IC) has made vital the need for accurate IC testing. This is the first book dedicated to the issues surrounding RFIC testing. This ground breaking work enables professionals to perform high-accuracy RF measurements of die and packages in the RF test lab. This timely volume defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration.
Autorenporträt
Scott A. Wartenberg is a staff engineer at RF Micro Devices and has done RF/microwave work at Agilent Technologies, Westinghouse, Raytheon, and the U.S. Department of Defense. A senior member of the IEEE and a member of the Microwave Theory and Techniques Society, he holds a Ph.D. and M.S. in Electrical Engineering from the Johns Hopkins University, and a B.S. in Electrical Engineering from the University of Tennessee. He has published extensively.