Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

Electronic Packaging Materials and Their Properties (eBook, PDF)

• Format: PDF

Produktbeschreibung

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. Electronic Packaging: Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. The book also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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Produktdetails

• Verlag: Taylor & Francis
• Seitenzahl: 128
• Erscheinungstermin: 19. Dezember 2017
• Englisch
• ISBN-13: 9781498730860
• Artikelnr.: 50533504

Autorenporträt

Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

Inhaltsangabe

Introduction
Properties of Electronics Packaging Materials
Electrical Properties
Thermal and Thermomechanical Properties
Mechanical Properties
Chemical Properties
Miscellaneous Properties
Zeroth-Level Packaging Materials
Semiconductors
Attachment Materials
Substrates
First-Level Packaging Materials
Wire Interconnects
Tape Interconnects
Case Materials
Lid Seals
Leads
Second-Level Packaging Materials
Reinforcement Fiber Materials
Resins
Laminates
Constraining Cores
Flexible Wiring Board Materials
Conductor Metals in Laminates
Conformal Coatings
Third-Level Packaging Materials
Backpanel Materials
Connectors Materials
Cables and Flex Circuit Materials
Summary
Appendices
Index