Uzodinma Okoroanyanwu
Chemistry and Lithography
Uzodinma Okoroanyanwu
Chemistry and Lithography
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Chemistry and Lithography provides a comprehensive treatment of the chemical phenomena in lithography in a manner that is accessible to a wide readership. The book presents topics on the optical and charged particle physics practiced in lithography, with a broader view of how the marriage between chemistry and optics has made possible the print and electronic revolutions of the digital age. The related aspects of lithography are thematically presented to convey a unified view of the developments in the field over time, from the very first recorded reflections on the nature of matter to the…mehr
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Chemistry and Lithography provides a comprehensive treatment of the chemical phenomena in lithography in a manner that is accessible to a wide readership. The book presents topics on the optical and charged particle physics practiced in lithography, with a broader view of how the marriage between chemistry and optics has made possible the print and electronic revolutions of the digital age. The related aspects of lithography are thematically presented to convey a unified view of the developments in the field over time, from the very first recorded reflections on the nature of matter to the latest developments at the frontiers of lithography science and technology.
Part I presents several important chemical and physical principles involved in the invention and evolution of lithography. Part II covers the processes for the synthesis, manufacture, usage, and handling of lithographic chemicals and materials. Part III investigates several important chemical and physical principles involved in the practice of lithography. Chemistry and Lithography is a useful reference for anyone working in the semiconductor industry.
Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Part I presents several important chemical and physical principles involved in the invention and evolution of lithography. Part II covers the processes for the synthesis, manufacture, usage, and handling of lithographic chemicals and materials. Part III investigates several important chemical and physical principles involved in the practice of lithography. Chemistry and Lithography is a useful reference for anyone working in the semiconductor industry.
Hinweis: Dieser Artikel kann nur an eine deutsche Lieferadresse ausgeliefert werden.
Produktdetails
- Produktdetails
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 892
- Erscheinungstermin: 8. März 2011
- Englisch
- Abmessung: 260mm x 183mm x 52mm
- Gewicht: 1936g
- ISBN-13: 9781118030028
- ISBN-10: 1118030028
- Artikelnr.: 32919028
- Verlag: Wiley & Sons
- 1. Auflage
- Seitenzahl: 892
- Erscheinungstermin: 8. März 2011
- Englisch
- Abmessung: 260mm x 183mm x 52mm
- Gewicht: 1936g
- ISBN-13: 9781118030028
- ISBN-10: 1118030028
- Artikelnr.: 32919028
Uzodinma Okoroanyanwu is the author of Chemistry and Lithography, published by Wiley.
Preface. Acronyms and Abbreviations. Part I. Origins, Inventions, and the
Evolution of Lithography. 1. Introduction to Lithography. 2. Invention of
Lithography and Photolithography. 2.1 Introduction. 2.2 Invention of
Lithography. 2.3 Invention of Photolithography. 2.4 Pioneers of
Photography. 3. Optical and Chemical Origins of Lithography. 3.1
Introduction. 3.2 Key Developments that Enabled the Invention and
Development of Lithography. 4. Evolution and Lithography. 4.1 Introduction.
4.2 Offset Lithography. 4.3 The Printed Circuit Board and the Development
of the Electronics Industry. 4.4 The Transistor and Microelectronics
Revolution. 4.5 The Integrated Circuit. 4.6 Other Notable Developments in
Transistor Technology. 4.7 Overall Device Technology Trends. 4.8
Semiconductor Lithography. 4.9 X-ray Lithography. 4.10 Electron-Beam
Lithography. 4.11 Ion-Beam Lithography. 4.12 Extreme Ultraviolet
Lithography. 4.13 Soft Lithography. 4.14 Proximal Probe Lithography. 4.15
Atom Lithography. 4.16 Stereolithography. 4.17 Molecular Self-Assembly
Lithography. Part II. Lithographic Chemicals. 5. Lithographic Chemicals.
5.1 Introduction. 5.2 Resists. 5.3 Antireflection Coatings. 5.4 Resist
Developers and Rinses. 5.5 Resist Strippers and Cleaners. 5.6 Offset
Lithographic Inks and Fountain Solutions. 6. Negative Resists. 6.1
Introduction. 6.2 Resins. 6.3 Types and Negative Resists. 6.4 General
Considerations on the Chemistry of Cross-Linking. 6.5 Negative Resists
Arising from Polymerization of Monomers. 6.6 General Considerations on the
Chemistry of Photoinitiated. 6.7 General Considerations of Photoinitiated
Condensation Polymerization. 6.8 General Considerations on the
Photoinitiated Cationic Polymerization Employed in Negative Resist Systems.
6.9 Practical Negative Resist Compositions Arising from Photopolymerization
of Monomers in the Presence of Polyfunctional Components. 6.19 Lithographic
Applications of Photopolymerization Negative Resists. 7. Positive Resists.
7.1 Introduction. 7.2 Types of Positive Resists. 7.3 Resist Materials for
Multilayer Resist Systems. 8. General Considerations on the Radiation and
Photochemistry of Resists. 8.1 Interaction of Radiation with Resists. 8.2
Excited State Complexes. 8.3 Energy Transfer. 8.4 Energy Migration in
Resist Polymers. 8.5 Spectral Sensitization. 8.6 Sensitization by Energy
Transfer. 8.7 Radiation Chemistry Versus Photochemistry of Resists. 8.8
Radiation Chemical Yield and Dosimetry. 8.9 Radiation Chemistry of
Polymers. 8.10 Sensitive and Exposure Radiation. 8.11 Exposure Mechanisms
of Resists and Exposure Radiation. 9. Antireflection Coatings and
Reflectivity Control. 9.1 Introduction. 9.2 Antireflection Coating
Strategies. 9.3 Bottom Antireflection Coatings. 9.4 Applications of Bottom
Antireflection Coatings. 9.5 Organic versus Inorganic Bottom Antireflection
Coating and Rework/Stripping Issues. 9.6 Bottom Antireflection
Coating-Resist Interactions. 9.7 Theory of Bottom Antireflection Coatings.
9.8 Bottom Antireflection Coatings for High-NA Imaging. Part III. The
Practice of Lithography. 10. Stone, Plate, and Offset Lithography. 10.1
Stone and Plate Lithography. 10.2 Offset Lithography. 10.3 The Offset
Lithographic Press. 10.4 Components of an Offset Lithographic Press. 10.5
Types of Offset Lithographic Inks. 10.6 Fabrication of Lithographic Offset
Plates. 10.7 The Offset Lithographic Process. 10.8 Waterless Offset
Lithography. 11. The Semiconductor Lithographic Process. 11.1 Introduction.
11.2 Adhesion Promotion. 11.3 Resist Coating. 11.4 Characterizing Ultrathin
Resist Processes. 11.5 Soft Bake/Prebake. 11.6 Alignment. 11.7 Exposure.
11.8 Postexposure Bake. 11.9 Monitoring Photoacid Generation in Thin
Photoresist Films by Means of Fluorescence Spectroscopy. 11.10 Postexposure
Bake Sensitivity. 11.11 Consequences of Acid Diffusion. 11.12 Development.
11.13 Dissolution Mechanism of Resist Polymers. 11.14 Dissolution Mechanism
of Phenolic Resists. 11.15 Comparison of Dissolution Characteristics of
Novolac and Poly(hydroxystyrene)-based Resists. 11.16 General Facts about
the Dissolution Mechanism of DNQ/Novolac Resists. 11.17 Resist Development
Issues. 11.8 Postdevelopment Bake and Resist Stabilization Treatments.
11.19 Measurement and Inspection. 11.20 Etching. 11.21 Rework/Stripping.
12. Lithographic Modeling. 12.1 Introduction. 12.2 Historical Background.
12.3 Structure of a Lithographic Model. 12.4 Basic Imaging Theory. 12.5
Accounting for Aberrations. 12.6 Aerial Image Formation Models. 12.7
Standing Wave Models. 12.8 Exposure Models. 12.9 Postexposure Bake Models.
12.10 Development Models. 12.11 Accuracy of Lithographic Models. 12.12
Applications/Uses of Lithographic Modeling. 13. Optical Lithography. 13.1
Introduction. 13.2 Elements of Optical Lithography. 13.3 UV Photochemistry
in the Exposure Chamber. 13.4 Optical Materials for UV and Visible Light
Lithographies. 13.5 Printing Modes. 13.6 General Considerations on Optics
Relevant to Lithography. 13.7 Optical Lithographic Technologies and Their
Performance. 14. X-Ray and Extreme Ultraviolet Lithographies. 14.1
Introduction. 14.2 Proximity X-Ray Lithography. 14.3 Extreme Ultraviolet
Lithography. 14.4 Optics Lifetime. 14.5 Contamination Processes. 14.6
Contamination Mitigation Strategies. 16.7 EUV Resists and Imaging
Performance. 15. Charged Particle Lithography. 15.1 Introduction. 15.2
Electron-Beam Lithography. 15.3 Types of Electron-Beam Lithographies. 15.4
Electron Projection Lithography. 15.5 Ion-Beam Lithography. 16. Lithography
in Integrated Circuit Device Fabrication. 16.1 Introduction. 16.2
Fabrication of a 90-nm CMOS Microprocessor. 17. Advanced Resist Processing
and Resist Resolution Limit Issues. 17.1 Introduction. 17.2 Resist Systems.
17.3 Advanced Resist Processing Techniques. 17.4 Resolution Limits Issues
of Resists. 17.5 Resist Materials Outlook for the 22-nm and Smaller
Technology Nodes. 17.6 Resist Processing Outlook for the 22-nm and Smaller
Technology Nodes. Afterword. Index.
Evolution of Lithography. 1. Introduction to Lithography. 2. Invention of
Lithography and Photolithography. 2.1 Introduction. 2.2 Invention of
Lithography. 2.3 Invention of Photolithography. 2.4 Pioneers of
Photography. 3. Optical and Chemical Origins of Lithography. 3.1
Introduction. 3.2 Key Developments that Enabled the Invention and
Development of Lithography. 4. Evolution and Lithography. 4.1 Introduction.
4.2 Offset Lithography. 4.3 The Printed Circuit Board and the Development
of the Electronics Industry. 4.4 The Transistor and Microelectronics
Revolution. 4.5 The Integrated Circuit. 4.6 Other Notable Developments in
Transistor Technology. 4.7 Overall Device Technology Trends. 4.8
Semiconductor Lithography. 4.9 X-ray Lithography. 4.10 Electron-Beam
Lithography. 4.11 Ion-Beam Lithography. 4.12 Extreme Ultraviolet
Lithography. 4.13 Soft Lithography. 4.14 Proximal Probe Lithography. 4.15
Atom Lithography. 4.16 Stereolithography. 4.17 Molecular Self-Assembly
Lithography. Part II. Lithographic Chemicals. 5. Lithographic Chemicals.
5.1 Introduction. 5.2 Resists. 5.3 Antireflection Coatings. 5.4 Resist
Developers and Rinses. 5.5 Resist Strippers and Cleaners. 5.6 Offset
Lithographic Inks and Fountain Solutions. 6. Negative Resists. 6.1
Introduction. 6.2 Resins. 6.3 Types and Negative Resists. 6.4 General
Considerations on the Chemistry of Cross-Linking. 6.5 Negative Resists
Arising from Polymerization of Monomers. 6.6 General Considerations on the
Chemistry of Photoinitiated. 6.7 General Considerations of Photoinitiated
Condensation Polymerization. 6.8 General Considerations on the
Photoinitiated Cationic Polymerization Employed in Negative Resist Systems.
6.9 Practical Negative Resist Compositions Arising from Photopolymerization
of Monomers in the Presence of Polyfunctional Components. 6.19 Lithographic
Applications of Photopolymerization Negative Resists. 7. Positive Resists.
7.1 Introduction. 7.2 Types of Positive Resists. 7.3 Resist Materials for
Multilayer Resist Systems. 8. General Considerations on the Radiation and
Photochemistry of Resists. 8.1 Interaction of Radiation with Resists. 8.2
Excited State Complexes. 8.3 Energy Transfer. 8.4 Energy Migration in
Resist Polymers. 8.5 Spectral Sensitization. 8.6 Sensitization by Energy
Transfer. 8.7 Radiation Chemistry Versus Photochemistry of Resists. 8.8
Radiation Chemical Yield and Dosimetry. 8.9 Radiation Chemistry of
Polymers. 8.10 Sensitive and Exposure Radiation. 8.11 Exposure Mechanisms
of Resists and Exposure Radiation. 9. Antireflection Coatings and
Reflectivity Control. 9.1 Introduction. 9.2 Antireflection Coating
Strategies. 9.3 Bottom Antireflection Coatings. 9.4 Applications of Bottom
Antireflection Coatings. 9.5 Organic versus Inorganic Bottom Antireflection
Coating and Rework/Stripping Issues. 9.6 Bottom Antireflection
Coating-Resist Interactions. 9.7 Theory of Bottom Antireflection Coatings.
9.8 Bottom Antireflection Coatings for High-NA Imaging. Part III. The
Practice of Lithography. 10. Stone, Plate, and Offset Lithography. 10.1
Stone and Plate Lithography. 10.2 Offset Lithography. 10.3 The Offset
Lithographic Press. 10.4 Components of an Offset Lithographic Press. 10.5
Types of Offset Lithographic Inks. 10.6 Fabrication of Lithographic Offset
Plates. 10.7 The Offset Lithographic Process. 10.8 Waterless Offset
Lithography. 11. The Semiconductor Lithographic Process. 11.1 Introduction.
11.2 Adhesion Promotion. 11.3 Resist Coating. 11.4 Characterizing Ultrathin
Resist Processes. 11.5 Soft Bake/Prebake. 11.6 Alignment. 11.7 Exposure.
11.8 Postexposure Bake. 11.9 Monitoring Photoacid Generation in Thin
Photoresist Films by Means of Fluorescence Spectroscopy. 11.10 Postexposure
Bake Sensitivity. 11.11 Consequences of Acid Diffusion. 11.12 Development.
11.13 Dissolution Mechanism of Resist Polymers. 11.14 Dissolution Mechanism
of Phenolic Resists. 11.15 Comparison of Dissolution Characteristics of
Novolac and Poly(hydroxystyrene)-based Resists. 11.16 General Facts about
the Dissolution Mechanism of DNQ/Novolac Resists. 11.17 Resist Development
Issues. 11.8 Postdevelopment Bake and Resist Stabilization Treatments.
11.19 Measurement and Inspection. 11.20 Etching. 11.21 Rework/Stripping.
12. Lithographic Modeling. 12.1 Introduction. 12.2 Historical Background.
12.3 Structure of a Lithographic Model. 12.4 Basic Imaging Theory. 12.5
Accounting for Aberrations. 12.6 Aerial Image Formation Models. 12.7
Standing Wave Models. 12.8 Exposure Models. 12.9 Postexposure Bake Models.
12.10 Development Models. 12.11 Accuracy of Lithographic Models. 12.12
Applications/Uses of Lithographic Modeling. 13. Optical Lithography. 13.1
Introduction. 13.2 Elements of Optical Lithography. 13.3 UV Photochemistry
in the Exposure Chamber. 13.4 Optical Materials for UV and Visible Light
Lithographies. 13.5 Printing Modes. 13.6 General Considerations on Optics
Relevant to Lithography. 13.7 Optical Lithographic Technologies and Their
Performance. 14. X-Ray and Extreme Ultraviolet Lithographies. 14.1
Introduction. 14.2 Proximity X-Ray Lithography. 14.3 Extreme Ultraviolet
Lithography. 14.4 Optics Lifetime. 14.5 Contamination Processes. 14.6
Contamination Mitigation Strategies. 16.7 EUV Resists and Imaging
Performance. 15. Charged Particle Lithography. 15.1 Introduction. 15.2
Electron-Beam Lithography. 15.3 Types of Electron-Beam Lithographies. 15.4
Electron Projection Lithography. 15.5 Ion-Beam Lithography. 16. Lithography
in Integrated Circuit Device Fabrication. 16.1 Introduction. 16.2
Fabrication of a 90-nm CMOS Microprocessor. 17. Advanced Resist Processing
and Resist Resolution Limit Issues. 17.1 Introduction. 17.2 Resist Systems.
17.3 Advanced Resist Processing Techniques. 17.4 Resolution Limits Issues
of Resists. 17.5 Resist Materials Outlook for the 22-nm and Smaller
Technology Nodes. 17.6 Resist Processing Outlook for the 22-nm and Smaller
Technology Nodes. Afterword. Index.
Preface. Acronyms and Abbreviations. Part I. Origins, Inventions, and the
Evolution of Lithography. 1. Introduction to Lithography. 2. Invention of
Lithography and Photolithography. 2.1 Introduction. 2.2 Invention of
Lithography. 2.3 Invention of Photolithography. 2.4 Pioneers of
Photography. 3. Optical and Chemical Origins of Lithography. 3.1
Introduction. 3.2 Key Developments that Enabled the Invention and
Development of Lithography. 4. Evolution and Lithography. 4.1 Introduction.
4.2 Offset Lithography. 4.3 The Printed Circuit Board and the Development
of the Electronics Industry. 4.4 The Transistor and Microelectronics
Revolution. 4.5 The Integrated Circuit. 4.6 Other Notable Developments in
Transistor Technology. 4.7 Overall Device Technology Trends. 4.8
Semiconductor Lithography. 4.9 X-ray Lithography. 4.10 Electron-Beam
Lithography. 4.11 Ion-Beam Lithography. 4.12 Extreme Ultraviolet
Lithography. 4.13 Soft Lithography. 4.14 Proximal Probe Lithography. 4.15
Atom Lithography. 4.16 Stereolithography. 4.17 Molecular Self-Assembly
Lithography. Part II. Lithographic Chemicals. 5. Lithographic Chemicals.
5.1 Introduction. 5.2 Resists. 5.3 Antireflection Coatings. 5.4 Resist
Developers and Rinses. 5.5 Resist Strippers and Cleaners. 5.6 Offset
Lithographic Inks and Fountain Solutions. 6. Negative Resists. 6.1
Introduction. 6.2 Resins. 6.3 Types and Negative Resists. 6.4 General
Considerations on the Chemistry of Cross-Linking. 6.5 Negative Resists
Arising from Polymerization of Monomers. 6.6 General Considerations on the
Chemistry of Photoinitiated. 6.7 General Considerations of Photoinitiated
Condensation Polymerization. 6.8 General Considerations on the
Photoinitiated Cationic Polymerization Employed in Negative Resist Systems.
6.9 Practical Negative Resist Compositions Arising from Photopolymerization
of Monomers in the Presence of Polyfunctional Components. 6.19 Lithographic
Applications of Photopolymerization Negative Resists. 7. Positive Resists.
7.1 Introduction. 7.2 Types of Positive Resists. 7.3 Resist Materials for
Multilayer Resist Systems. 8. General Considerations on the Radiation and
Photochemistry of Resists. 8.1 Interaction of Radiation with Resists. 8.2
Excited State Complexes. 8.3 Energy Transfer. 8.4 Energy Migration in
Resist Polymers. 8.5 Spectral Sensitization. 8.6 Sensitization by Energy
Transfer. 8.7 Radiation Chemistry Versus Photochemistry of Resists. 8.8
Radiation Chemical Yield and Dosimetry. 8.9 Radiation Chemistry of
Polymers. 8.10 Sensitive and Exposure Radiation. 8.11 Exposure Mechanisms
of Resists and Exposure Radiation. 9. Antireflection Coatings and
Reflectivity Control. 9.1 Introduction. 9.2 Antireflection Coating
Strategies. 9.3 Bottom Antireflection Coatings. 9.4 Applications of Bottom
Antireflection Coatings. 9.5 Organic versus Inorganic Bottom Antireflection
Coating and Rework/Stripping Issues. 9.6 Bottom Antireflection
Coating-Resist Interactions. 9.7 Theory of Bottom Antireflection Coatings.
9.8 Bottom Antireflection Coatings for High-NA Imaging. Part III. The
Practice of Lithography. 10. Stone, Plate, and Offset Lithography. 10.1
Stone and Plate Lithography. 10.2 Offset Lithography. 10.3 The Offset
Lithographic Press. 10.4 Components of an Offset Lithographic Press. 10.5
Types of Offset Lithographic Inks. 10.6 Fabrication of Lithographic Offset
Plates. 10.7 The Offset Lithographic Process. 10.8 Waterless Offset
Lithography. 11. The Semiconductor Lithographic Process. 11.1 Introduction.
11.2 Adhesion Promotion. 11.3 Resist Coating. 11.4 Characterizing Ultrathin
Resist Processes. 11.5 Soft Bake/Prebake. 11.6 Alignment. 11.7 Exposure.
11.8 Postexposure Bake. 11.9 Monitoring Photoacid Generation in Thin
Photoresist Films by Means of Fluorescence Spectroscopy. 11.10 Postexposure
Bake Sensitivity. 11.11 Consequences of Acid Diffusion. 11.12 Development.
11.13 Dissolution Mechanism of Resist Polymers. 11.14 Dissolution Mechanism
of Phenolic Resists. 11.15 Comparison of Dissolution Characteristics of
Novolac and Poly(hydroxystyrene)-based Resists. 11.16 General Facts about
the Dissolution Mechanism of DNQ/Novolac Resists. 11.17 Resist Development
Issues. 11.8 Postdevelopment Bake and Resist Stabilization Treatments.
11.19 Measurement and Inspection. 11.20 Etching. 11.21 Rework/Stripping.
12. Lithographic Modeling. 12.1 Introduction. 12.2 Historical Background.
12.3 Structure of a Lithographic Model. 12.4 Basic Imaging Theory. 12.5
Accounting for Aberrations. 12.6 Aerial Image Formation Models. 12.7
Standing Wave Models. 12.8 Exposure Models. 12.9 Postexposure Bake Models.
12.10 Development Models. 12.11 Accuracy of Lithographic Models. 12.12
Applications/Uses of Lithographic Modeling. 13. Optical Lithography. 13.1
Introduction. 13.2 Elements of Optical Lithography. 13.3 UV Photochemistry
in the Exposure Chamber. 13.4 Optical Materials for UV and Visible Light
Lithographies. 13.5 Printing Modes. 13.6 General Considerations on Optics
Relevant to Lithography. 13.7 Optical Lithographic Technologies and Their
Performance. 14. X-Ray and Extreme Ultraviolet Lithographies. 14.1
Introduction. 14.2 Proximity X-Ray Lithography. 14.3 Extreme Ultraviolet
Lithography. 14.4 Optics Lifetime. 14.5 Contamination Processes. 14.6
Contamination Mitigation Strategies. 16.7 EUV Resists and Imaging
Performance. 15. Charged Particle Lithography. 15.1 Introduction. 15.2
Electron-Beam Lithography. 15.3 Types of Electron-Beam Lithographies. 15.4
Electron Projection Lithography. 15.5 Ion-Beam Lithography. 16. Lithography
in Integrated Circuit Device Fabrication. 16.1 Introduction. 16.2
Fabrication of a 90-nm CMOS Microprocessor. 17. Advanced Resist Processing
and Resist Resolution Limit Issues. 17.1 Introduction. 17.2 Resist Systems.
17.3 Advanced Resist Processing Techniques. 17.4 Resolution Limits Issues
of Resists. 17.5 Resist Materials Outlook for the 22-nm and Smaller
Technology Nodes. 17.6 Resist Processing Outlook for the 22-nm and Smaller
Technology Nodes. Afterword. Index.
Evolution of Lithography. 1. Introduction to Lithography. 2. Invention of
Lithography and Photolithography. 2.1 Introduction. 2.2 Invention of
Lithography. 2.3 Invention of Photolithography. 2.4 Pioneers of
Photography. 3. Optical and Chemical Origins of Lithography. 3.1
Introduction. 3.2 Key Developments that Enabled the Invention and
Development of Lithography. 4. Evolution and Lithography. 4.1 Introduction.
4.2 Offset Lithography. 4.3 The Printed Circuit Board and the Development
of the Electronics Industry. 4.4 The Transistor and Microelectronics
Revolution. 4.5 The Integrated Circuit. 4.6 Other Notable Developments in
Transistor Technology. 4.7 Overall Device Technology Trends. 4.8
Semiconductor Lithography. 4.9 X-ray Lithography. 4.10 Electron-Beam
Lithography. 4.11 Ion-Beam Lithography. 4.12 Extreme Ultraviolet
Lithography. 4.13 Soft Lithography. 4.14 Proximal Probe Lithography. 4.15
Atom Lithography. 4.16 Stereolithography. 4.17 Molecular Self-Assembly
Lithography. Part II. Lithographic Chemicals. 5. Lithographic Chemicals.
5.1 Introduction. 5.2 Resists. 5.3 Antireflection Coatings. 5.4 Resist
Developers and Rinses. 5.5 Resist Strippers and Cleaners. 5.6 Offset
Lithographic Inks and Fountain Solutions. 6. Negative Resists. 6.1
Introduction. 6.2 Resins. 6.3 Types and Negative Resists. 6.4 General
Considerations on the Chemistry of Cross-Linking. 6.5 Negative Resists
Arising from Polymerization of Monomers. 6.6 General Considerations on the
Chemistry of Photoinitiated. 6.7 General Considerations of Photoinitiated
Condensation Polymerization. 6.8 General Considerations on the
Photoinitiated Cationic Polymerization Employed in Negative Resist Systems.
6.9 Practical Negative Resist Compositions Arising from Photopolymerization
of Monomers in the Presence of Polyfunctional Components. 6.19 Lithographic
Applications of Photopolymerization Negative Resists. 7. Positive Resists.
7.1 Introduction. 7.2 Types of Positive Resists. 7.3 Resist Materials for
Multilayer Resist Systems. 8. General Considerations on the Radiation and
Photochemistry of Resists. 8.1 Interaction of Radiation with Resists. 8.2
Excited State Complexes. 8.3 Energy Transfer. 8.4 Energy Migration in
Resist Polymers. 8.5 Spectral Sensitization. 8.6 Sensitization by Energy
Transfer. 8.7 Radiation Chemistry Versus Photochemistry of Resists. 8.8
Radiation Chemical Yield and Dosimetry. 8.9 Radiation Chemistry of
Polymers. 8.10 Sensitive and Exposure Radiation. 8.11 Exposure Mechanisms
of Resists and Exposure Radiation. 9. Antireflection Coatings and
Reflectivity Control. 9.1 Introduction. 9.2 Antireflection Coating
Strategies. 9.3 Bottom Antireflection Coatings. 9.4 Applications of Bottom
Antireflection Coatings. 9.5 Organic versus Inorganic Bottom Antireflection
Coating and Rework/Stripping Issues. 9.6 Bottom Antireflection
Coating-Resist Interactions. 9.7 Theory of Bottom Antireflection Coatings.
9.8 Bottom Antireflection Coatings for High-NA Imaging. Part III. The
Practice of Lithography. 10. Stone, Plate, and Offset Lithography. 10.1
Stone and Plate Lithography. 10.2 Offset Lithography. 10.3 The Offset
Lithographic Press. 10.4 Components of an Offset Lithographic Press. 10.5
Types of Offset Lithographic Inks. 10.6 Fabrication of Lithographic Offset
Plates. 10.7 The Offset Lithographic Process. 10.8 Waterless Offset
Lithography. 11. The Semiconductor Lithographic Process. 11.1 Introduction.
11.2 Adhesion Promotion. 11.3 Resist Coating. 11.4 Characterizing Ultrathin
Resist Processes. 11.5 Soft Bake/Prebake. 11.6 Alignment. 11.7 Exposure.
11.8 Postexposure Bake. 11.9 Monitoring Photoacid Generation in Thin
Photoresist Films by Means of Fluorescence Spectroscopy. 11.10 Postexposure
Bake Sensitivity. 11.11 Consequences of Acid Diffusion. 11.12 Development.
11.13 Dissolution Mechanism of Resist Polymers. 11.14 Dissolution Mechanism
of Phenolic Resists. 11.15 Comparison of Dissolution Characteristics of
Novolac and Poly(hydroxystyrene)-based Resists. 11.16 General Facts about
the Dissolution Mechanism of DNQ/Novolac Resists. 11.17 Resist Development
Issues. 11.8 Postdevelopment Bake and Resist Stabilization Treatments.
11.19 Measurement and Inspection. 11.20 Etching. 11.21 Rework/Stripping.
12. Lithographic Modeling. 12.1 Introduction. 12.2 Historical Background.
12.3 Structure of a Lithographic Model. 12.4 Basic Imaging Theory. 12.5
Accounting for Aberrations. 12.6 Aerial Image Formation Models. 12.7
Standing Wave Models. 12.8 Exposure Models. 12.9 Postexposure Bake Models.
12.10 Development Models. 12.11 Accuracy of Lithographic Models. 12.12
Applications/Uses of Lithographic Modeling. 13. Optical Lithography. 13.1
Introduction. 13.2 Elements of Optical Lithography. 13.3 UV Photochemistry
in the Exposure Chamber. 13.4 Optical Materials for UV and Visible Light
Lithographies. 13.5 Printing Modes. 13.6 General Considerations on Optics
Relevant to Lithography. 13.7 Optical Lithographic Technologies and Their
Performance. 14. X-Ray and Extreme Ultraviolet Lithographies. 14.1
Introduction. 14.2 Proximity X-Ray Lithography. 14.3 Extreme Ultraviolet
Lithography. 14.4 Optics Lifetime. 14.5 Contamination Processes. 14.6
Contamination Mitigation Strategies. 16.7 EUV Resists and Imaging
Performance. 15. Charged Particle Lithography. 15.1 Introduction. 15.2
Electron-Beam Lithography. 15.3 Types of Electron-Beam Lithographies. 15.4
Electron Projection Lithography. 15.5 Ion-Beam Lithography. 16. Lithography
in Integrated Circuit Device Fabrication. 16.1 Introduction. 16.2
Fabrication of a 90-nm CMOS Microprocessor. 17. Advanced Resist Processing
and Resist Resolution Limit Issues. 17.1 Introduction. 17.2 Resist Systems.
17.3 Advanced Resist Processing Techniques. 17.4 Resolution Limits Issues
of Resists. 17.5 Resist Materials Outlook for the 22-nm and Smaller
Technology Nodes. 17.6 Resist Processing Outlook for the 22-nm and Smaller
Technology Nodes. Afterword. Index.